Title: Improving copper electroplating process for 3D-stacked integrated circuits
Authors: Lühn, Ole ×
Radisic, Alex
Ruythooren, Wouter
Celis, Jean-Pierre
Van Hoof, Christiaan
Swinnen, Bart #
Issue Date: Mar-2008
Series Title: Semiconductor Manufacturing Magazine China vol:5 pages:26-28
Publication status: published
KU Leuven publication type: DI
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems
Centre for Surface Chemistry and Catalysis
Surface and Interface Engineered Materials
× corresponding author
# (joint) last author

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