|ITEM METADATA RECORD
|Title: ||Design of an optimal heat-sink geometry for forced convection air cooling of Multi-chip Modules|
|Authors: ||Boesmans, B|
Beyne, E #
|Issue Date: ||Jun-1993 |
|Host Document: ||Proceedings of the Eurotherm Seminar n° 29: Thermal Management of Electronic Systems pages:267-276|
|Conference: ||Eurotherm Seminar n° 29: Thermal Management of Electronic Systems location:Delft, The Netherlands date:Jun 14-16, 1993|
|Publication status: ||published|
|KU Leuven publication type: ||IC|
|Appears in Collections:||Applied Mechanics and Energy Conversion Section|
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