Title: Solder Parameter Sensitivity for CSP life-time prediction using simulation-based optimisation method
Authors: Vandevelde, B ×
Beyne, E
Zhang, GQ
Caers, J
Vandepitte, Dirk
Baelmans, Martine #
Issue Date: Oct-2002
Series Title: IEEE Transactions on Electronics Packaging Manufacturing vol:25 issue:4 pages:318-325
ISSN: 1521-334X
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Production Engineering, Machine Design and Automation (PMA) Section
Applied Mechanics and Energy Conversion Section
× corresponding author
# (joint) last author

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