Conference Record of the 31st Annual Meeting of IEEE-IAS vol:3 pages:1755-1761
31st Annual Meeting of IEEE-IAS edition:31 location:San Diego, USA date:Oct 6-10, 1996
This paper describes the influence of an electric field on the liquid-vapor interface during film boiling from a horizontal surface of stagnant fluids (pool boiling). An iterative solution technique is used to calculate the equilibrium shape of the liquid-vapor interface during film boiling. In each iteration step, a fourth order Runge-Kutta integration technique is used to calculate the shape of the interface and a boundary element method to calculate the electric field. It is shown that an electric field elongates the vapor bubbles formed on this interface and that this effect has to be accounted for in the existing heat transfer models in order to describe the influence of an electric field on the heat transfer coefficient during film boiling.