1996 Industry-Applications-Society Annual Meeting, Date: 1996/10/06 - 1996/10/10, Location: CA, SAN DIEGO
IEEE Transactions on Industry Applications
Author:
Keywords:
safety engineering, Science & Technology, Technology, Engineering, Multidisciplinary, Engineering, Electrical & Electronic, Engineering, electrohydrodynamics (EHD), enhanced heat transfer, film boiling, HEAT-TRANSFER, ENHANCEMENT, STABILITY, DROPS, 08 Information and Computing Sciences, 09 Engineering, 40 Engineering
Abstract:
This paper describes the influence of an electric field on the liquid-vapor interface during film boiling from a horizontal surface of stagnant fluids (pool boiling). An iterative solution technique is used to calculate the equilibrium shape of the liquid-vapor interface during film boiling. In each iteration step, a fourth-order Runge-Kutta integration technique is used to calculate the shape of the interface and a boundary element method is used to calculate the electric field. It is shown that an electric field elongates the vapor bubbles formed on this interface, and it is suggested that this effect has to be accounted for in the existing heat transfer models in order to describe the influence of an electric field on the heat transfer coefficient during film boiling. © 1997 IEEE.