|ITEM METADATA RECORD
|Title: ||Thermal Challenges in Next Generation Electronic Systems: Summary of Panel Presentations and Discussions|
|Authors: ||Garimella, SV|
Andros, F #
|Issue Date: ||Dec-2002 |
|Publisher: ||IEEE-Inst Electrical Electronics Engineering INC|
|Series Title: ||IEEE Transactions on Component and Packaging Technologies vol:25 issue:4 pages:569-575|
|Publication status: ||published|
|KU Leuven publication type: ||IT|
|Appears in Collections:||Applied Mechanics and Energy Conversion Section|
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