Title: Thermal Challenges in Next Generation Electronic Systems: Summary of Panel Presentations and Discussions
Authors: Garimella, SV
Joshi, K
Bar-Cohen, A
Mahajan, R
Toh, CK
Carey, VP
Baelmans, Martine
Lohan, J
Sammakia, B
Andros, F #
Issue Date: Dec-2002
Publisher: IEEE-Inst Electrical Electronics Engineering INC
Series Title: IEEE Transactions on Component and Packaging Technologies vol:25 issue:4 pages:569-575
ISSN: 1521-3331
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Applied Mechanics and Energy Conversion Section
# (joint) last author

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