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Title: Hybrid integration of multi-finger HEMTs: a comparison between flipchip and substrate removal
Authors: Das, J
Ruythooren, W
Vandersmissen, R
Oprins, Herman
Derluyn, J
Germain, M
Borghs, G #
Issue Date: Aug-2005
Host Document: Proceedings of the International Conference on Nitride Semiconductors
Conference: International Conference on Nitride Semiconductors location:Bremen, Germany date:Aug 28 - Sep 2, 2005
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Applied Mechanics and Energy Conversion Section
Research Group Experimental Neurosurgery and Neuroanatomy
# (joint) last author

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