Title: Doubling the critical temperature of La1.9Sr0.1CuO4 using epitaxial strain
Authors: Locquet, Jean-Pierre ×
Perret, J
Fompeyrine, J
Machler, E
Seo, Jin Won
Van Tendeloo, G #
Issue Date: 1998
Series Title: Nature vol:394 issue:6692 pages:453-456
Conference: date:IBM Corp, Div Res, Zurich Res Lab, CH-8803 Ruschlikon, Switzerland; Univ Neuchatel, Inst Phys, CH-2000 Neuchatel, Switzerland; Univ Bern, Inst Inorgan Chem, CH-3012 Bern, Switzerland; Univ Antwerp, Ruca, EMAT, B-2020 Antwerp, Belgium
Abstract: The discovery(1) of high-temperature superconductivity in copper oxides raised the possibility that superconductivity could be achieved at room temperature. But since 1993, when a critical temperature (T-c) of 133 K was observed in the HgBa2Ca2Cu3O8+delta (ref. 2), no further progress has been made in raising the critical temperature through material design. It has been shown, however, that the application of hydrostatic pressure can raise T-c-up to similar to 164 K in the case of HgBa2Ca2Cu3O8+delta (ref. 3). Here we show by analysing the uniaxial strain and pressure derivatives of T-c, that compressive epitaxial strain in thin films of copper oxide superconductors could in principle generate much larger increases in the critical temperature than obtained by comparable hydrostatic pressures. We demonstrate the experimental feasibility of this approach for the compound La1.9Sr0.1CuO4, where we obtain a critical temperature of 49 K in strained single-crystal thin films-roughly double the bulk value of 25 K. Furthermore, the resistive behaviour at low temperatures (but above T-c) of the strained samples changes markedly, going from insulating to metallic.
ISSN: 0028-0836
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Solid State Physics and Magnetism Section
Physical Metallurgy and Materials Engineering Section (-)
× corresponding author
# (joint) last author

Files in This Item:

There are no files associated with this item.

Request a copy


All items in Lirias are protected by copyright, with all rights reserved.

© Web of science