IEEE 74th Electronic Components and Technology Conference (ECTC), Date: 2024/05/28 - 2024/05/31, Location: CO, Denver
Publication date:
2024-01-01
Pages:
498 -
505
ISSN:
979-8-3503-7599-2
Publisher:
Institute of Electrical and Electronics Engineers
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024
Author:
Chang, Xinyue
Oprins, Herman ; Vermeersch, Bjorn ; Cherman, Vladimir ; Lofrano, Melina ; Park, Seongho ; Tokei, Zsolt ; De Wolf, Ingrid
Keywords:
Science & Technology, Technology, Engineering, Electrical & Electronic, Engineering, Mechanical, Materials Science, Multidisciplinary, Engineering, Materials Science, BEOL, BSPDN, out-of-plane thermal resistance, multi-scale thermal modeling, prediction, experimental characterization, INTERCONNECT