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25th Eurosensors Conference, Date: 2011/09/04 - 2011/09/07, Location: Athens, Greece

Publication date: 2011-01-01
Volume: 25 Pages: 1497 - 1500
Publisher: Elsevier; Amsterdam

Procedia Engineering

Author:

Bogaerts, L
Phommahaxay, A ; Gerets, C ; Jaenen, P ; Van Hoof, R ; Severi, S ; De Coster, J ; Beernaert, R ; Rudra, S ; Soussan, P ; Witvrouw, Ann ; Kaltsas, G ; Tsamis, C

Keywords:

Temporary 0-level packaging, optical applications, Unity 2203P, Science & Technology, Technology, Instruments & Instrumentation, 09 Engineering

Abstract:

This paper reports on a novel temporary 0-level packaging process for MEMS (Micro Electro Mechanical Systems), in particular MEMS for optical applications. In this process protective caps, with a heat decomposable and photo-patternable polymer sealing ring, are placed by flip-chip on the MEMS wafer. The resulting temporary packages are gross leak tight, fulfil the MIL spec for shear testing and respect the thermal budget of Al-coated SiGe micro-mirrors. After debonding the cap, the SiGe mirrors are unharmed. © 2011 Published by Elsevier Ltd.