13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Date: 2012/08/13 - 2012/08/16, Location: PEOPLES R CHINA, Guilin

Publication date: 2012-01-01
Pages: 482 - 486
ISSN: 978-1-4673-1682-8
Publisher: IEEE

2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012)

Author:

Wei, Tiwei
Cai, Jian ; Wang, Qian ; Liu, Ziyu ; Li, Yinan ; Wang, Tao ; Wang, Dejun ; Bi, K ; Yang, D ; Cai, M

Keywords:

Science & Technology, Technology, Engineering, Electrical & Electronic, Engineering, VIAS