48th Annual IEEE International Reliability Physics Symposium - IRPS, Date: 2010/01/02 - 2010/01/02, Location: Anaheim, CA USA

Publication date: 2010-01
Pages: 591 - 598
ISSN: 1541-7026
DOI: 10.1109/IRPS.2010.5488764
Publisher: IEEE

Proceedings of the 48th Annual IEEE International Reliability Physics Symposium - IRPS

Author:

Croes, Kristof
Wilson, Chris ; Lofrano, Melina ; Vereecke, Bart ; Beyer, Gerald ; Tokei, Zsolt

Keywords:

Science & Technology, Technology, Physical Sciences, Engineering, Electrical & Electronic, Physics, Applied, Engineering, Physics, BEOL, copper, stress-induced-voiding, electromigration, vacancy, stress, FEM, SUBMICRON INTERCONNECT, CU, STRAIN, LINES