Author:

Keywords:

Science & Technology, Physical Sciences, Physics, Applied, Physics, CHEMICAL-VAPOR-DEPOSITION, LOW-K DIELECTRICS, PORE-SIZE DISTRIBUTION, SPIN-ON-GLASS, DIFFUSION BARRIER INTEGRITY, OXYGEN PLASMA RESISTANCE, DRY ETCH CHARACTERISTICS, X-RAY REFLECTIVITY, HYDROGEN-SILSESQUIOXANE, THIN-FILMS, 01 Mathematical Sciences, 02 Physical Sciences, 09 Engineering, Applied Physics, 40 Engineering, 49 Mathematical sciences, 51 Physical sciences

Abstract:

The classification, characteristics and properties of low-k-dielectrics were discussed. It was found that in case of organic polymers, the quality of the WCN barrier obtained by ALD on an organic polymer film was dependent on surface treatment. The pore sealing and the deposition of a thin continuous copper diffusion barrier on a porous dielectric were also elaborated.