Author:

Keywords:

electromagnetic valve, pilot valve, two-phase cooling, heat sink, microelectronic circuits

Abstract:

This paper reports the progress towards two-phase flow control for cooling of microelectronic circuits and namely on the design, optimization and testing of an electromagnetic valve, capable of coping with the fast dynamics of bubble formation inside heat sinks. As measurements on single-phase cooling have shown, sufficient changes in flow and pressure drop can be realised in less than 10 ms for proper two-phase control. The main valve is driven by a pilot valve to reduce the required actuation force. It is designed to cope with up to 6 bar absolute system pressure and up to 1 bar differential pressure at maximum flow rates of 4 g/s (15 kg/h), sufficient to remove a heat flux of 500 W/cm^2.